This paper focuses on the manufacturing method and characteristics of a copper paste sintered embedded resistor 24-layer microwave circuit board. The process utilizes Taconic high-frequency resistor materials and involves a multi-step approach to create blind hole embedded resistors

including 7 laminations

6 blind hole electroplatings

3 pulse electroplatings

6 copper paste plug holes

1 resin plug hole

and panel grinding

along with 14 copper reduction steps and 7 back drilling steps. The process is complex and involves numerous control factors. To address quality issues arising from layer misalignment

expansion and contraction

resistance value control

and the unique processes of copper paste sintering

experimental plans were developed for improvement. The final product meets IPC inspection standards and has received customer approval

indicating that the manufacturing process for this copper paste sintered embedded resistor circuit board is feasible.