As the marginal benefit of transistor scaling decreases while lithography

yield

and design costs rise

advanced packaging has become a central route for sustaining semiconductor system performance beyond monolithic integration. This paper develops a compact but systematic framework for comparing four major packaging families: 2.5D interposer or bridge integration

3D stacking with through-silicon vias (TSVs) or hybrid bonding

fan-out wafer/panel-level packaging

and chiplet-based heterogeneous integration.The study synthesizes academic literature

technology roadmaps

and representative industrial plat- forms

and evaluates each option using six criteria: interconnect density

bandwidth and latency

power efficiency

thermal reliability risk

manufacturing complexity

and cost/ecosystem maturity.The analysis shows that advanced packaging should not be understood as a single replacement for front-end scaling. Instead

it operates as a system-scaling layer in which process node

architecture

memory placement

substrate technology

thermal design

and interface standards are jointly optimized.2.5D and 3D integration are most attractive for AI and high-performance computing

fan-out is well suited to thin mobile and edge devices

and mature-node chiplet or system-in-package solutions remain important for automotive and industrial electronics.The paper concludes with an application-matching model that supports early-stage technology selec- tion in post-Moore chip design.